The Chinese company Advanced Micro-Fabrication Equipment (AMEC) launched six new machines for semiconductor manufacturing during the CSEAC 2026 event in Wuxi. The equipment includes machines for etching, film deposition, and silicon carbide (SiC) chip production, expanding the company's operations beyond its traditional specialization in etching.
The new machines include four film deposition equipment units, one extreme etching machine for 3D NAND and DRAM memories, and devices for silicon carbide epitaxy on 8-inch wafers. The company is introducing technologies such as plasma-enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD), in addition to the new Primo XD-RIE etching machine.
China is seeking to increase its semiconductor manufacturing capacity to reduce dependence on foreign suppliers, especially after export restrictions imposed by the United States and its allies. AMEC positions itself as an alternative domestic supplier, competing in a larger segment of the chip factory equipment market.
The company announced an investment of 2.04 billion yuan (approximately 303.5 million dollars) in research and development in the first half of 2026, representing an increase of 36.9% compared to the previous year. Currently, AMEC is developing more than 20 new machines in various categories, but its success will depend on these machines' ability to meet the stringent standards of the semiconductor industry.
