On Tuesday, September 8, Qualcomm announced a collaboration with Amazon to provide custom silicon at scale for large-scale artificial intelligence data centers. The two companies are working together on AI inference as well as on high-performance optical connectivity solutions. This partnership combines Amazon's comprehensive, secure, and cost-effective AI infrastructure with Qualcomm Technologies' leadership in energy-efficient processing, silicon design, and system-level integration.
The optical connectivity solutions resulting from this collaboration will be designed to support the growing scale and bandwidth demands of AI infrastructure, leveraging Qualcomm Technologies' advanced SerDes and optical DSP technologies. The partnership comes in the context of exponential growth in AI workloads, driven by unprecedented demand for computing, storage, networking, and memory bandwidth.
As part of this expanded collaboration, Qualcomm Technologies plans to use AWS's AI infrastructure, including Amazon Bedrock, for electronic design automation workloads, aiming to reduce chip design cycles. The president and CEO of Qualcomm Incorporated, Cristiano Amon, noted that data center infrastructure will require advances in both computing and connectivity to deliver higher performance more efficiently.
The vice president of AWS, Prasad Kalyanaraman, stated that this collaboration with Qualcomm Technologies builds on an existing solid partnership and reflects the shared commitment to pushing the boundaries of what is possible, offering more efficient, higher-performing, and cost-effective infrastructure for customers.
